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Thermographic analyses of the hot-air soldering on the electronic circuit board

Citace: [] HONNER, M., LITOŠ, P. Thermographic analyses of the hot-air soldering on the electronic circuit board. In 13th International Conference on Thermal Engineering and Thermorammetry (THERMO). Budapest: Scientific Society of Measurement, Automation and Informatics , 2003. s. 288-293.
Druh: STAŤ VE SBORNÍKU
Jazyk publikace: eng
Anglický název: Thermographic analyses of the hot-air soldering on the electronic circuit board
Rok vydání: 2003
Místo konání: Budapest
Název zdroje: Scientific Society of Measurement, Automation and Informatics
Autoři: Milan Honner , Pavel Litoš
Abstrakt EN: Evaluation of thermographic measurement of the hot-air soldering of joints on printed circuit board is reported. The main part of study consists of the emisivity spatial and temporal determination. The measuremen errors caused by the emissivity variations are shown. Temperature evolutions on joints soldered cannot be easily evaluated due to the soldering paste emissivity changes. On contrary these changes can be effectively used in the individual technological alternatives comparison.
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