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Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu

Citace: HIRMAN, M., RENDL, K., STEINER, F., WIRTH, V. Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu. Drážďany, 2014.
Druh: PŘEDNÁŠKA, POSTER
Jazyk publikace: eng
Anglický název: Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu
Rok vydání: 2014
Autoři: Ing. Martin Hirman , Ing. Karel Rendl , Doc. Ing. František Steiner Ph.D. , Ing. Václav Wirth ,
Abstrakt EN: The paper describes the effect of the solder profile on the formation of an intermetallic layer in the solder composition of 57.6% Bi-42% Sn-0.4% Ag. Soldered joints were made by soldering of chip resistors of 1206 size with different soldering reflow profiles. Solder pads on the PCB are made of copper therefore they mainly make Cu6Sn5 IMC. This layer has an effect on the mechanical strength of the soldered joint. Samples are measured by using the shear strength test. The thickness of the IMC layer is measured by Confocal Laser Scanning Microscope. IMC layer thickness grows with greater delivered energy into the joint during soldering.
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