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Epoxy Resin Curing Process Evaluation Based on Signal Frequency Analysis from Interdigital Structure Sensor

Citace:
BLECHA, T., PIHERA, J. Epoxy Resin Curing Process Evaluation Based on Signal Frequency Analysis from Interdigital Structure Sensor. In Electronics System Integration Technology Conference ESTC 2010 in Berlin. Piscataway: IEEE, 2010. s. 1-4. ISBN: 978-1-4244-8553-6
Druh: STAŤ VE SBORNÍKU
Jazyk publikace: eng
Anglický název: Epoxy Resin Curing Process Evaluation Based on Signal Frequency Analysis from Interdigital Structure Sensor
Rok vydání: 2010
Místo konání: Piscataway
Název zdroje: IEEE
Autoři: Ing. Tomáš Blecha Ph.D. , Ing. Josef Pihera Ph.D. ,
Abstrakt EN: The epoxy resin curing is a chemical process that consists of several important steps within its curing time. These steps could be identified as gelation point, curing, vitrification and final solid state of the resin. These points of curing process are identifiable by standard electrical measurement methods but the use of unique test equipment is necessary. Therefore, new possibilities of detection these important points of curing process are to be searched. All information about epoxy resin curing have to be known for correct technology process control. Based on that, it is necessary to analyze the curing process and to find its important curing points. During epoxy resin curing process some electrical parameters are changing. And here comes this new method into account. If a suitable sensor is placed in the epoxy resin during curing process then the above mentioned important points of curing process could be monitored and identified based on frequency analysis of signals from this sensors. The electrode structure sensor was used for measuring of signals and their changes during the epoxy resin curing process. This article deals with the evaluation process based on the spectral analysis of signals obtained from electrode structure sensor.
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