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Influence of electrically conductive adhesive amount on shear strength of glued joints

Citace:
HIRMAN, M., STEINER, F. Influence of electrically conductive adhesive amount on shear strength of glued joints. In Proceedings of the 20th International Conference on Applied Electronics 2015 (APPEL 2015). Piscataway: IEEE, 2015. s. 53-56. ISBN: 978-80-261-0385-1 , ISSN: 1803-7232
Druh: STAŤ VE SBORNÍKU
Jazyk publikace: eng
Anglický název: Influence of electrically conductive adhesive amount on shear strength of glued joints
Rok vydání: 2015
Místo konání: Piscataway
Název zdroje: IEEE
Autoři: Ing. Martin Hirman , Doc. Ing. František Steiner Ph.D. ,
Abstrakt EN: This paper deals with the influence of electrically conductive adhesive amount on shear strength of joints glued by EPO-TEK? H20S and MG 8331S. These joints were made by gluing of chip resistors 1206, 0805 and 0603 with two curing profiles for each adhesive. The different thickness of stencils and reductions of the hole in stencils were used. These differences have an effect on the amount of conductive adhesives on the samples. The curing profiles and various amounts of the adhesives have an effect on the mechanical strength of the joint. Samples were measured after curing process by using shear strength test with the device LabTest 3.030.
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