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Influence of electrically conductive adhesive amount on shear strength of glued joints on flexible substrates

Citace:
HIRMAN, M., STEINER, F. Influence of electrically conductive adhesive amount on shear strength of glued joints on flexible substrates. In Abstracts proceedings : international flash conference IMAPS : Czech and Slovak chapter. Brno: Brno University of Technology, 2015. s. 30-31. ISBN: 978-80-214-5270-1
Druh: STAŤ VE SBORNÍKU
Jazyk publikace: eng
Anglický název: Influence of electrically conductive adhesive amount on shear strength of glued joints on flexible substrates
Rok vydání: 2015
Místo konání: Brno
Název zdroje: Brno University of Technology
Autoři: Ing. Martin Hirman , Doc. Ing. František Steiner Ph.D. ,
Abstrakt EN: This article deals with the influence of electrically conductive adhesive amount on shear strength of joints glue by ?EPO-TEK? H20S? and ?MG 8331S? on two types of flexible substrates (MELINEX? ST504, DuPont? Pyralux? AC). These joints were made by gluing of chip resistors 1206, 0805 and 0603 with two curing profiles for each adhesive and with two different curing technologies. The different thickness of stencils and reductions of the hole in stencils were used for the experiment. These differences have an effect on the amount of conductive adhesives on the samples. Samples were measured after curing process by using shear strength test with the device LabTest 3.030. The article presents effects of different curing profiles, various flexible substrates and different amounts of the adhesives on the mechanical strength of the joint.
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