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Compact device for detecting single event effects in semiconductor components

Citace:
BROULÍM, P., BARTOVSKÝ, J., BROULÍM, J., BURIAN, P., GEORGIEV, V., HOLÍK, M., KRAUS, V., KRUTINA, A., MOLDASCHL, J., PAVLÍČEK, V., POSPÍŠIL, S., VLÁŠEK, J. Compact device for detecting single event effects in semiconductor components. In Proceedings of Papers : 2015 23rd Telecommunications Forum (TELFOR 2015). Piscataway: IEEE, 2015. s. 639-642. ISBN: 978-1-5090-0055-5
Druh: STAŤ VE SBORNÍKU
Jazyk publikace: eng
Anglický název: Compact device for detecting single event effects in semiconductor components
Rok vydání: 2015
Místo konání: Piscataway
Název zdroje: IEEE
Autoři: Ing. Pavel Broulím , Ing. Jan Bartovský , Ing. Jan Broulím , Ing. Petr Burian Ph.D. , Doc. Dr. Ing. Vjačeslav Georgiev , Ing. Michael Holík , Ing. Václav Kraus , Ing. Aleš Krutina , Ing. Jan Moldaschl , Ing. Vladimír Pavlíček Ph.D. , Stanislav Pospíšil , Ing. Jakub Vlášek ,
Abstrakt EN: The paper describes a compact system for detecting Single Event Effects (SEE) in semiconductor components. The SEE is caused by a hit into a electronic chip with an energetic particle. The hit can cause unexpected behaviour of the system. The tested component is called Device Under Test (DUT). The structure of the system is shown and used components are described with their main tasks. Some of results of the running system are shown.
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