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Influence of electrically conductive adhesive quantity on insulation distance and shear strength of glued joints

Citace:
HIRMAN, M., STEINER, F. Influence of electrically conductive adhesive quantity on insulation distance and shear strength of glued joints. In Proceedings of the International Spring Seminar of Electronics Technology (ISSE 2016). Piscataway: IEEE, 2016. s. 134-139. ISBN: 978-1-5090-1389-0
Druh: STAŤ VE SBORNÍKU
Jazyk publikace: eng
Anglický název: Influence of electrically conductive adhesive quantity on insulation distance and shear strength of glued joints
Rok vydání: 2016
Místo konání: Piscataway
Název zdroje: IEEE
Autoři: Ing. Martin Hirman , Doc. Ing. František Steiner Ph.D. ,
Abstrakt EN: This article deals with the impact of electrically conductive adhesive quantity on the insulation distance and shear strength of joints glued by adhesives ?MG 8331S? and Hysol CA3150? on rigid substrates FR-4. These joints were formed by adhesive bonding of chip resistors 0805. Nine different shapes of apertures in stencil were used for this experiment. These differences have an effect on the quantity of conductive adhesives which is used on the samples and an effect on the insulation distance between pads. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the effects of different shapes apertures in stencil and different quantities of adhesives on the mechanical strength of the joint and the insulation distance between pads.
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