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Properties of temperature stable solder pastes

STUNA, J., STEINER, F., HIRMAN, M. Properties of temperature stable solder pastes. In 6th Electronics System-Integration Technology Conference (ESTC 2016) : proceedings. Piscataway: IEEE, 2016. s. 1-6. ISBN: 978-1-5090-1402-6
Jazyk publikace: eng
Anglický název: Properties of temperature stable solder pastes
Rok vydání: 2016
Místo konání: Piscataway
Název zdroje: IEEE
Autoři: Bc. Jakub Stuna , Doc. Ing. František Steiner Ph.D. , Ing. Martin Hirman ,
Abstrakt EN: This article deals with the temperature stable solder pastes and the using of this pastes in a manufacturing process. The nineteen solder pastes were chosen at the start of the research and were compared. For the experiment four solder pastes (Loctite GC 10, KOKI M406 ECO, AIM M8, Indium 8.9HF) with the best parameters in datasheets were chosen. In the experiment fourteen parameters were measured or monitored. All results were transformed on points and multiplied with significant coefficients. The overall results were calculated and the pastes with the highest point amount were recommended for production usage.
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