Přejít k obsahu


Solder pastes quantity vs. mechanical strength

Citace:
HIRMAN, M., STEINER, F. Solder pastes quantity vs. mechanical strength. In Book of Abstracts : 40th International Microelectronics and Packaging IMAPS Poland 2016 Conference. Wrocław: Wrocław University of Science and Technology, 2016. s. 93-94. ISBN: 978-83-932464-2-7
Druh: STAŤ VE SBORNÍKU
Jazyk publikace: eng
Anglický název: Solder pastes quantity vs. mechanical strength
Rok vydání: 2016
Místo konání: Wrocław
Název zdroje: Wrocław University of Science and Technology
Autoři: Ing. Martin Hirman , Doc. Ing. František Steiner Ph.D. ,
Abstrakt EN: The article deals with the impact of solder pastes quantity on the shear strength of joints soldered by SnBi, SnAgCu, SnCu, SnPb and SnAgBiÍn alloys on the rigid PCBs. Different thicknesses of stencil and reductions in the size of the ho}e in stencils were used for this experiment. These differences have an effect on the quantity of solder pastes (100%, 71%, 47%). This article presents the effects of different solder alloys and different quantities of solder pastes on the mechanical shear strength of the joint.
Klíčová slova

Zpět

Patička