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Temperature stable solder pastes - properties and reliability

Citace:
STEINER, F., STUNA, J., HIRMAN, M. Temperature stable solder pastes - properties and reliability. In Abstracts Proceedings : International Flash Conference IMAPS : Czech and Slovak Chapter. Brno: Brno University of Technology, 2016. s. 44-45. ISBN: 978-80-214-5416-3
Druh: STAŤ VE SBORNÍKU
Jazyk publikace: eng
Anglický název: Temperature stable solder pastes - properties and reliability
Rok vydání: 2016
Místo konání: Brno
Název zdroje: Brno University of Technology
Autoři: Doc. Ing. František Steiner Ph.D. , Bc. Jakub Stuna , Ing. Martin Hirman ,
Abstrakt EN: This article deals with one of the newest trends in soldering that means a using of the temperature stable solder pastes. These pastes do not need to be stored in fridge and do not need to be tempered to the room temperature before their use. On the market, several brands of temperature stable solder pastes are available. The article describes designed and performed experiments which aim to verify the declared properties. The experiments were designed and performed according Design of Experiments methodology. The results and recommendation for practice are presented at the end of the article.
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